The manufacture of smaller, more tightly packed, integrated circuits requires facilities designed to meet stringent vibration requirements. Vibration control is complicated by the need for extensive process support equipment and some service personnel in the vicinity of the sensitive machines. Facility criteria that have been developed on the basis of earlier facility experience have tended to be unrealistic and inadequately defined. The present paper delineates the shortcomings of these criteria and indicates how better criteria may be defined.
Ungar, E. E., and Gordon, C. G., “Vibration Challenges in Microelectronics Manufacturing,” Shock and Vibration Bulletin, 53(I):51-58 (May 1983). [Elias Klein Memorial Lecture]
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